[By NBC-1TV H. J Yook]Toshiba Corporation (http://goo.gl/p8j1Ek) (TOKYO:6502) today announced the launch of photorelays in the industry’s smallest[1] package. Shipment of mass production products starts from today.

The new products, “TLP3403” and “TLP3412”, utilize the industry’s smallest package for photocouplers, the Toshiba-developed VSON (Very Small Outline Non-leaded) package. Compared to equivalent Toshiba products in a USOP package, the new photorelays reduce the assembly area by 50% and volume by 60%. This can contribute to the development of smaller and thinner sets and also makes it possible to increase the number of photorelays on a circuit board to 1.3 times to 1.5 times that of conventional products.

Also, by using a new internal structure, a chip-on-chip structure[2], the new products, while retaining the same electrical characteristics as conventional USOP package products, secure improved high-frequency characteristics, which are necessary for signal transmission. The new photocouplers are suitable for various tester applications, especially for use in power-line switching and measuring-line switching.